About us
Winbond was established in September 1987 and listed on Taiwan Stock Exchange in 1995 with headquarters in Central Taiwan Science Park, Taichung, Taiwan.
Winbond is a specialty memory IC company engaged in design, manufacturing and sales services. From product design, research and development, and wafer fabrication to the marketing of brand name products, Winbond endeavors to provide its global clientele top quality low to medium density memory solutions.
Winbond's major product lines include Code Storage Flash Memory, Specialty DRAM and Mobile DRAM. Our advantage of technological autonomy and prudent capacity strategy enables us to build a highly flexible production system and create synergy among product lines, which allows us to meet the diverse demands of customers while building the brand image.
http://www.winbond.com.tw
Mobile DRAM
MobileDRAM
- PSRAM
- HyperRAMTM
- LPSDR SDRAM
- LPDDR1 SDRAM
- LPDDR2 SDRAM
- LPDDR3 SDRAM
- LPDDR4 SDRAM
- LPDDR4X SDRAM
- KGD
Specialty DRAM
Product Category
- SDRAM
- DDR SDRAM
- DDR2 SDRAM
- DDR3 SDRAM
- KGD
Code Storage Flash Memory
Product Category
- Serial NOR Flash
- 1.2V Serial NOR Flash
- QspiNAND Flash
- High Performance QspiNAND Flash
- OctalNAND Flash
- SLC NAND Flash
- NAND Based MCP
- SpiStack® Flash
- 安全认证闪存
- 良品裸晶圆
GMI Contact window Of North China
朱宁 Eric Zhu
E-Mail : ericszhu@gmitec.com
Phone : +86-138-0257-1411
GMI Contact window Of South China
王玺林 Carl Wang
E-Mail : carlwang@gmitec.com
Phone : +86-156-8944-2347
GMI Contact window Of Taiwan
曾名慶 Karl Tseng
E-Mail : karltseng@gmitec.com
Phone : +886-932205991