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- To supply the world's smallest 64-gigabit NAND memory chipon second generation 19 nanometer (nm) process technology -21 May, 2013 TOKYO—Toshiba Corporation (TOKYO: 6502) today announced that the company has developed second generation 19 nanometer process technology that it will apply to mass production of 2-bit-per-cell 64 gigabit NAND memory chips later this month. Toshiba has used the new generation technology to develop the world's smallest* 2-bit –per-cell 64 gigabit NAND memory chips, with an area of only 94 square millimeters. Using a unique high speed writing method, the next generation chips can achieve a write speed of up to 25 megabytes a second - the world's fastest class* in 2-bit-per-cell chips. Toshiba is also developing 3-bit-per-cell chips by using this process technology and aims to start mass production in the second quarter of this fiscal year. The company will initially introduce 3-bit, multi-level-cell products for smartphones and tablets by developing a controller compatible with eMMC, and will subsequently extend application to notebook PCs by developing a controller compliant with solid state drives (SSD). NAND flash memory is an essential component of a diverse line-up of consumer products, including memory cards, smartphones, tablets and notebook PCs, and is increasingly deployed…

Serial Flash Leader Has Highest Revenue, Most Units Shipped in Fast-Growing Market   Increasing Production of 58nm Multi-I/O SpiFlash® Memories from 32Mb to 256Mb   SAN JOSE, Calif., USA, and TAICHUNG, Taiwan – April 10, 2013 -- Winbond Electronics Corporation, a global supplier of Flash memories and inventor of the popular Multi-I/O Serial Flash architecture, today announced it is now the top supplier of Serial NOR Flash memories worldwide.  Based on recent market data from WebFeet Research, Winbond took the number-one position in 2012 with 27.5 percent market share of the $1.34 billion Serial Flash market. Winbond shipped 1.7 billion Flash memories in 2012, which is 33 percent of all Serial Flash units worldwide and more than any other NOR Flash supplier. Additionally, Winbond announced it is increasing production of its 58-nanometer (58nm) SpiFlash® memories at the company’s 12-inch-wafer fabrication facility in Taichung, Taiwan, to meet growing customer demand. Winbond’s 58nm Multi-I/O SpiFlash family ranges in density from 32 megabits (Mb) to 256Mb and features the popular Serial Peripheral Interface (SPI), Dual-SPI, Quad-SPI and QPI formats.   Serial Flash Market Continues to Grow   “Worldwide Serial NOR Flash shipments will continue to grow from $1.34 billion in 2012 to greater than $2.6 billion by 2016,”…

A Lineup of Ultra-High Resolution Displays and Innovative Display Applications will be showcased at Shenzhen's CODE 2013   AU Optronics Corp. ("AUO" or the "Company") (TAIEX: 2409; NYSE: AUO) announced that it will participate in China Information Technology Expo & China Optoelectronics Display Expo 2013 (CITE & CODE 2013) in Shenzhen from April 10 to 12. With the theme of “Experiencing the ultimate visual experience with ultra high definition” this year, AUO will demonstrate its display applications and technologies focusing on the ultra-high resolution, super narrow bezel, high performance touch solution, and diverse applications & technologies with high added value.  Among them, AUO will debut the 5-inch Full HD OLED smartphone display with resolutions as high as 443 ppi (pixel per inch), the highest* resolution OLED in the world.   The exhibition highlights include the 5-inch FHD OLED panel, a full lineup of smartphone applications with high resolution and super narrow bezel panels ranging from 5” to 5.7”, the 10.1” AHVA tablet display, and the 65-inch and 55-inch UHD 4K LCD TV panels. For public information displays, AUO will showcase the 55” switchable mirror display and the 65” hybrid transparent display for the vending machine. Furthermore, AUO will also exhibit…

HSINCHU, Taiwan – March 13, 2013 – Realtek Semiconductor Corp. (Taiwan Stock Exchange: 2379.TW), one of the world’s largest IC design houses and a market leader in USB interface application technology, today announced the Realtek SuperSpeed USB (USB 3.0) hub controller (RTS5401) has passed USB 3.0 compliance and certification testing by the USB Implementers Forum (USB-IF).   “The USB-IF is pleased that Realtek has achieved certification for its SuperSpeed USB hub controller (RTS5401),” said Jeff Ravencraft, President & COO, USB-IF. “Realtek is a USB-IF member company dedicated to USB device standardization, and their efforts support the USB-IF’s mission to expand the SuperSpeed USB ecosystem”.   As the SuperSpeed USB market continues to grow at a rapid pace, hub solutions are needed to conveniently manage multiple consumer devices using USB 3.0. Realtek SuperSpeed USB hubs provide a flexible connection between the host and peripheral devices, with no sacrifice in transmission performance.   The Realtek RTS5401 is an advanced USB 3.0 hub controller with up to four downstream ports and with USB Battery Charging v1.2 support. The hub is backward compatible to USB 2.0 and USB 1.1. The System-on-a-Chip (SoC) successfully integrates a Switching Regulator and Low Dropout Regulator so that low-power…

Hsinchu, Taiwan, Mar. 8, 2013 － Nuvoton Technology Corporation proudly announces NCT6683D, the new eSIO series IC, which integrates traditional SIO with built-in uC or uP to provide the best green control on MB / AIO systems. The “e” of eSIO stands for the "embedded” controller based SIO. NCT6683D, combining a built-in microcontroller and traditional legacy SIO functions, supports a rich set of features and targets the All-in-One PC applications, high-end motherboard applications that need the built-in microcontroller to fulfill the customized features, server applications for BMC-lite segments, such as workstation, storage and cloud, and any other applications that microcontroller can better execute the performance. The microcontroller inside NCT6683D is the industrial standard 1T 8-bit microcontroller and the firmware code is stored in an external SPI flash, which could be updated via LPC interface or PS/2 interface with special tools provided by Nuvoton. In addition to the built-in microcontroller, the features that NCT6683D implements, such as PECI (Platform Environment Control Interface), SB-TSI interface, SMBus master, DSW (Deep Sleep Well) glue logic, power supervisor, USB host, Real Time Clock (RTC), and real time Port80 display through UART TX with Nuvoton debug card or AP, make it also the up-to-date IC for both Intel®…

Actions Semiconductor leverages silicon-proven network-on-chip (NoC) technology to ease routing congestion and improve timing in next-generation tablets . SUNNYVALE, California – February 7, 2013 – Arteris, Inc., the inventor and only supplier of silicon-proven commercial network-on-chip (NoC) interconnect IP solutions, today announced that Actions Semiconductor Co., Ltd. (ADR) (NASDAQ:ACTS) has secured licenses for the Arteris®FlexNoC™ interconnect IPfor use in their multimedia application processors. Actions will use FlexNoC for front-end designs, ensuring that data-intensive applications such as interactive animation and high resolution video do not suffer from routing congestion or timing issues. As consumers demand tablets with multiple, real-time functions, Actions’ applications processors will meet those requirements. “At Actions Semiconductor, our goal is to provide a powerful platform with differentiated features and cost-competitive total solutions for our customers,” said Mr. Shawn Li, CTO of Actions Semiconductor. “With the ArterisFlexNoc interconnect IP, software tools and design support we have confidence our multimedia application processors will magnify their innovations and speed time to market.” “Arteris is excited that one of China’s leading fabless semiconductor companies chose our NOC interconnect IP to advance next generation technology,” said K. Charles Janac, President and CEO of Arteris. “FlexNoC will enable SoC designers to deliver cutting edge…

TOKYO–Toshiba Corporation (TOKYO: 6502) today announced that it has developed NANO FLASH™-100 much faster access for embedded microcontrollers, based on Toshiba's original NANO FLASH™. Development background: The rich functionality and high speed capabilities of embedded microcontrollers require much flash memory with much faster access rates. Toshiba has recognized and responded to this by developing NANO FLASH™ which merges two features: high speed programming, based on NAND flash memory cell device technology; and NOR flash memory circuit technology. Toshiba has subsequently brought this high level performance to its original microcontrollers and to ARM core-based microcontrollers. Now, as more users use ARM core-based microcontrollers, there is an emerging need for greater speed and large memory capacities. NANO FLASH™-100 is highly suited to this market. Features: The newly developed NANO FLASH™-100 achieves a zero-wait cycle during random access at 100MHz operation (note 1), the industry's top class. This allows the core in ARM-based microcontrollers to fully utilize the superior performance and code density of applications requiring high speed and large capacity memory. Using the ultra low power technology of NANO FLASH™ microcontrollers, a wide range of high speed, low power applications developments are available. Toshiba will follow up on its first NANO FLASH™-100…

Recognized for its visionary approach and technologies in the mobile consumer storage category. TOKYO-- Toshiba Corporation (TOKYO: 6502) is pleased to announce that its MQ01ABDH hybrid drive series was awarded the Storage Visions™ Visionary Award in the Mobile Consumer Storage product category at the 12th annual Storage Visions Conference, held in Las Vegas, U.S.A. from January 6th to 7th. Storage Visions is an annual storage products technical event covering hard disk drives (HDD) and solid state drives (SSD), and the award recognizes excellence in embedded storage solutions in mobile consumer devices. Today's PCs must meet increasingly strong demands for storage capacities that can handle multiple HD videos and other data-rich sources, and deliver read/write speeds that support excellent performance. Toshiba's MQ01ABDH hybrid drive integrates NAND flash memory with a hard drive to make full use of the large capacity of the HDD and the fast data access speeds of the NAND. It also features self-learning caching algorithms that optimize performance by learning the system user's data access patterns. The Visionary Award was presented in recognition of Toshiba's innovative approach and the advanced technologies the company brought to the hybrid drive. Shipments of the MQ01ABDH series started in autumn 2012 for…

HSINCHU, Taiwan – December 14, 2012 – Realtek Semiconductor Corp. (Taiwan Stock Exchange: 2379.TW), one of the world’s leading IC providers, today announced that its Hi-Fi Audio Single Chip with Voice/Sound DSP and CODEC (ALC5642) has received an ‘Innovative Product Award 2012’ from the Hsinchu Science Park Administration in Taiwan. The Realtek ALC5642 is the first audio single chip to integrate a Hi-Fi audio codec, high-efficiency/low-power amplifiers, and voice/sound DSP, as well as Realtek trademarked SounzReal™ sound effect technology. The high-integration and low-power architecture of the ALC5642 is designed for mobile product applications such as tablet and smartphone. Products featuring the ALC5642 will provide a high-quality voice communication experience, and excellent acoustic-fidelity and immersive audio when listening to music or watching movies etc.  SounzReal™ sound effect technology includes BassBack (virtual bass), OmniSound (virtual surround), and TruTreble/Bass (Treble/Bass enhancement). The high performance Voice DSP provides wide-band level voice processing capabilities and very high voice communication quality. Built-in noise suppression, echo cancellation, and duplex capabilities all feature class-leading technologies. The voice DSP builds-in a proprietary long-range, low-noise recording technology enabling a smartphone or tablet to function as a voice recorder and camcorder. “Our ALC5642 was designed specifically to offer a top quality…

Hsinchu, Taiwan, Nov. 19, 2012-Winbond Electronics Corporation today announced that it has signed an NT$ 5 billion three-year syndicated loan agreement. The signing ceremony was hosted by Mr. Arthur Y.C. Chiao, Chairman of Winbond and Mr. James Chen, President of Chinatrust Commercial Bank at Sherwood Hotel Taipei. The main purpose of the syndication loan is to finance the term loan repayments and the working capital needs. The syndication was led by Chinatrust Commercial Bank, Taishin International Bank, First Commercial Bank, DBS Bank and participated by six other financial institutions. The loan was oversubscribed and final facility amount was closed at NT$ 5 billion. The oversubscription represents banks’ recognition of Winbond’s credit standing and positive business prospects. Winbond is a leading supplier of Specialty Memory with three major product lines including Specialty DRAM, Mobile RAM, and NOR Flash. We are able to deal with uncertainties of economic conditions and provide tier-1 customers with quality services through technology migration, balanced capacity mix of NOR Flash and DRAM products. In addition, mass production of 58nm and 46nm technologies will enhance cost competitiveness. With strong financial condition, Winbond will strive to deliver stable profitability and achieve  sustainable competitive advantages in the future.

JVC KENWOOD Corporation (JVCKENWOOD), a global manufacturer specializing in electronics products, and SYNDIANT, Inc. (SYNDIANT), a leading US manufacturer of Pico Liquid Crystal On Silicon (LCOS) devices, are pleased to announce that two companies have formed a partnership to promote the development and production of LCOS products. 1. Background and purpose Since JVCKENWOOD released its first multimedia projector using the LCOS device, which is a kind of reflective liquid crystal device, in 1997, it has gained widespread recognition for projectors that achieve higher levels of brightness, resolution, contrast, and color reproducibility than conventional projectors. Its current lineup based on full high-definition (HD) includes 3D-enabled 4K2K models and 3D-enabled 8K4K models for professional use. JVCKENWOOD has been developing head-up displays (HUDs), which help make driving a car safer, taking advantage of LCOS technology accumulated over many years. In January 2012, it exhibited a prototype HUD at the 2012 International CES, held in Las Vegas, U.S. In October 2012, it completed development of a first-generation HUD, started shipments, and launched full-scale marketing activities. SYNDIANT’s breakthrough patented all-digital LCOS technology is well suited for ultra-small projection applications. SYNDIANT’s innovative architecture enables crystal clear high definition images with low power in a very small form-factor. JVCKENWOOD…

Realtek Semiconductor Corp. (Taiwan Stock Exchange: 2379.TW), one of the world’s leading network and multimedia IC providers, announced today that the Wi-Fi Alliance has selected Realtek solutions for its Wi-Fi CERTIFIED Miracast™ Test Bed as the benchmark to ensure interoperability on future certified products. The Miracast™ certification program, based on the Wi-Fi Alliance Wi-Fi Display specification, leverages the existing Wi-Fi framework and enables wireless streaming of video and audio content seamlessly from one device (Source) to a second device (Display). Realtek’s RTL8192DE and RTD1185, along with the associated Wi-Fi chipset RTL8192DU, are among the first chipsets to achieve Miracast™ certification. “Industry and end-users have demanded robust high-definition low-latency multimedia-quality wireless display connections between their mobile devices and larger displays. Wi-Fi CERTIFIED Miracast™ meets those needs and provides a wireless multimedia experience on a par with that of a wired connection, while maintaining freedom of mobility within the coverage range of a Wi-Fi network”, said Realtek’s Vice President and Spokesman, Jessy Chen. “Realtek’s high-performance SoC family and its Wi-Fi chipsets will help to drive the global adoption of Wi-Fi CERTIFIED Miracast™ on mobile and CE devices and ensure end-user satisfaction”. Realtek’s solutions listed in the Wi-Fi CERTIFIED Miracast™ test bed include:…